...as a creative partner facing the challenges of the 21st century. We tackle the trends of constant miniaturization and ever higher integration densities with classical and novel microsystems manufacturing technologies and develop MEMS design and manufacturing solutions with you. We process, characterize and adapt mechanical and tribological properties of actuators and sensors, which may be based on magnetic effects, as well as MEMS and MEMS materials.
...as a creative partner facing the challenges of the 21st century. We tackle the trends of constant miniaturization and ever higher integration densities with classical and novel microsystems manufacturing technologies and develop MEMS design and manufacturing solutions with you. We process, characterize and adapt mechanical and tribological properties of actuators and sensors, which may be based on magnetic effects, as well as MEMS and MEMS materials.
Within our team of administrative staff, precision engineering trainees, technical staff, students and scientific staff, the IMPT's research activities revolve around the development, evaluation, and integration of microsystems technology for a wide variety of fields. The IMPT's core competencies include thin film technology, mechanical micromachining and packaging technology. Microtechnological production is carried out in the institute's very own 350 m² class ISO 5 clean room. There, among other things, functional and insulating layers are realized via PVD processes, evaporation, cathode sputtering, CVD processes such as PECVD and atomic layer deposition, as well as galvanic processes. Structuring is performed lithographically, via wet chemical or dry physical etching processes such as ion beam, plasma or reactive ion deep etching. In the mechanical laboratories, surfaces are planarized via chemical-mechanical polishing, wafers are separated into chips by means of cutting loops, components are electrically contacted, components are additively manufactured (3D printing) and samples are measured magnetically, mechanically, tribologically and optically.